GlobalFoundries signs a multi-year $2bn deal to make silicon interposers for TSMC's AI chip packaging in New York

GlobalFoundries has agreed to make silicon interposers for TSMC's CoWoS packaging at its fab in Malta, New York. The company's release calls it a “Multi-year $2 billion agreement.” Under the deal, GlobalFoundries supplies manufacturing service to TSMC and adds capacity at Malta. The two companies present it as the first US-based source of these parts for CoWoS.

“The agreement has an initial term of five years and provides a framework for future capacity expansion,” the release says. “Volume production is expected to begin ramping at GF's Malta site during the first half of 2028.”

The only executive quoted is Ed Kaste, GlobalFoundries' senior vice president of CMOS Business. “Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” he said. The release names no end customer, does not say how the $2bn divides between new equipment and wafer purchases, and carries no quote from TSMC.

• Confirmed A multi-year $2bn agreement for GlobalFoundries to make silicon interposers for TSMC's CoWoS at Malta, New York. GlobalFoundries
• Confirmed The agreement has an initial five-year term, and volume production is expected to begin ramping in the first half of 2028. GlobalFoundries